Home >  Products > Wire to Board Connector > Wafer Housing Terminal > 3.0mm
A3001 Series Micro-Fit 3.0mm Wire to Board Connecor

A3001 Series Micro-Fit 3.0mm Wire to Board Connecor

Pitch :3.0mm 

Part number :A3001 Series 

Lead time :7-10days

Sample :free 

Equivalent of Molex Micro-fit series 
Type :dual row and single row 

product details

Specifications:

Contact resistance:≤10mΩ

Insulation resistance:≥1000mΩ

Rated voltage:250V AC DC

Rated current :5.0 A AC DC

Withstand voltage:1000V AC/minute

Temperature range:-40℃~+105℃


Contact Us
  • Tel: +86 -769-81682918    +86 13632682082
  • E-mail: sales.dg@liandaconn.com
  • :
  • Skype: live:.cid.56c217c3f3c89bf2
  • Shenzhen oversea &marketing department address: Room B606, Block B, West Silicon Valley, 5010 Bao 'an Avenue, Bao 'an District, Shenzhen, Guangdong,China
  • Dongguan factory address: Building 1,No.118, Yanwu Road,Yanwu community,Dalingshan Town,Dongguan city ,Guangdong , 523838, China
Follow Us